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Co-Sponsored by the Photonics Chapter
As silicon photonics and co-packaged optics (CPO) technologies continue to scale for AI, cloud, and high-bandwidth networking applications, reliability qualification methodologies are becoming increasingly critical. While much of the industry focus has been on performance and integration density, standardized approaches for qualification, reliability assessment and long-term service life prediction remain an important industry challenge.
This webinar will present the motivation, structure, and key technical considerations behind the emerging JEDEC work that Cisco has led on Silicon Photonics Qualification and Reliability Requirements. The session will discuss reliability expectations and qualification strategies for silicon photonics devices, chiplets, integrated optical assemblies, and heterogeneous integration approaches used in AI and datacenter applications. The webinar is intended for engineers and technologists working in silicon photonics, advanced packaging, NPO, CPO, datacenter infrastructure, reliability engineering, semiconductor manufacturing, and optical module development.
Speaker(s): Farnood Rezaie,
Virtual: https://events.vtools.ieee.org/m/560599
