ABSTRACT
The next wave of intelligence isn’t in the cloud—it’s in machines. Humanoid robots, autonomous vehicles, drones, and defense systems are becoming intelligent, autonomous, and always connected—while operating under strict size, weight, and power (SWaP) constraints.
And here’s the shift: AI doesn’t move, see, or act without communication. RF and wireless systems are no longer just enablers—they are becoming the bottleneck.
Meeting these demands is pushing traditional planar scaling and disaggregated system design to their limits. 3D heterogeneous integration offers a new path—tightly combining RF, power, and compute into compact, high-performance architectures.
But this is not just a packaging challenge. It requires rethinking the system—co-design across devices, architecture, and integration.
This talk explores how RF and wireless systems must evolve for the AI-driven edge, and presents Maxwell Mission’s platform approach—leveraging GaN, CMOS, and advanced packaging—to enable the next generation of intelligent, connected machines.
[]
BIOGRAPHY
Dr. Ibrahim Khalil is the Founder and CEO of Maxwell Mission Inc., a U.S.-based semiconductor company advancing the physical layer of intelligent and connected systems through innovations in RF, power, and heterogeneous integration. With over two decades of experience, his work spans RF power amplifiers, transceivers, and system-level architectures that underpin modern wireless infrastructure, defense platforms, and emerging edge AI systems.
Prior to founding Maxwell Mission, Dr. Khalil held leadership roles at NXP Semiconductors, where he served as Director of Strategic Business Development and Director of R&D for the Advanced Analog Business Unit. Earlier in his career, he was with Infineon Technologies, contributing to multiple generations of RF power technologies with significant commercial impact.
Dr. Khalil is an Adjunct Faculty member at Arizona State University and holds over 30 U.S. patents. His current work focuses on integrating device, packaging, and system co-design to enable next-generation RF, wireless, and edge intelligence platforms.
Date: May 14, 2026 (Thursday) 5:30-7:30pm
Location: Macro Technology Works Building Conference Room 3654 ((https://maps.app.goo.gl/8pmm79TXL5teH3Ux7))
Agenda:
Refreshments: 5:30-6:00pm
Seminar Talk: 6:00-7:00pm
MTW Tour: 7:00-7:30pm
Room: Conference Room 3654, Bldg: Macro Technology Works (MTW), 7700 S River Pkwy, Tempe, Arizona, United States, 85284
This event has passed.
