BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//IEEE Region 6 - ECPv6.17.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://www.ieeer6.org
X-WR-CALDESC:Events for IEEE Region 6
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20250309T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20251102T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20260308T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20261101T090000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
TZNAME:PDT
DTSTART:20270314T100000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
TZNAME:PST
DTSTART:20271107T090000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=America/Los_Angeles:20260810T080000
DTEND;TZID=America/Los_Angeles:20260812T170000
DTSTAMP:20260726T191348Z
CREATED:20260710T171411Z
LAST-MODIFIED:20260726T191348Z
UID:10000658-1786348800-1786554000@www.ieeer6.org
SUMMARY:IEEE Electronic Packaging Design and Characterization Summer School 2026
DESCRIPTION:The IEEE Electronics Packaging Society (EPS) San Diego Chapter\, in partnership with San Diego State University (SDSU)\, is pleased to present a three-day summer school focused on the fundamentals and emerging trends in electronic packaging design and characterization.\nThe program is designed for senior undergraduate students\, graduate students\, recent graduates\, and practicing engineers interested in advanced packaging technologies\, heterogeneous integration\, signal integrity\, power integrity\, thermal management\, materials\, package characterization\, and electronic design automation.\nAgenda:\nThe first two days will feature lectures from leading experts in industry and academia\, followed by hands-on demonstrations and training sessions using advanced EDA and measurement tools provided by Keysight Technologies. The third day will include an industry site visit to Kyocera.\nTopics Include\n– Signal Integrity and S-Parameters\n– Power Distribution Network (PDN) Measurement\n– Electronic Packaging Materials\n– Advanced Semiconductor Packaging\n– Heterogeneous Integration\n– Package Thermal Design\n– Die-Package Co-Design\n– 5G Beamformer Packaging\n– Integrated Passives\n– Package Characterization and Measurements\n– Electronic Design Automation for Advanced Packaging\nParking Information\nAttendees can find parking information and reserve parking in advance using the following link:\n(https://www.offstreet.io/events/R9T7M4I3)\nBldg: Parma Payne Goodall Alumni Center\, Allan Bailey Library\, 5250 55th St\, San Diego\, California\, United States\, 92182
URL:https://www.ieeer6.org/event/ieee-electronic-packaging-design-and-characterization-summer-school-2026/
LOCATION:Bldg: Parma Payne Goodall Alumni Center\, Allan Bailey Library\, 5250 55th St\, San Diego\, California\, United States\, 92182
CATEGORIES:Local Events
ATTACH;FMTTYPE=image/jpeg:https://www.ieeer6.org/wp-content/uploads/ieee-region-6-event-01.jpg
END:VEVENT
END:VCALENDAR